MAX5865
Ultra-Low-Power, High-Dynamic-
Performance, 40Msps Analog Front End
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
DD
to GND, OV
DD
to OGND................................-0.3V to +3.3V
GND to OGND.......................................................-0.3V to +0.3V
IA+, IA-, QA+, QA-, ID+, ID-, QD+, QD-, REFP, REFN,
REFIN, COM to GND..............................-0.3V to (V
DD
+ 0.3V)
DD0–DD9, SCLK, DIN, CS, CLK,
DA0–DA7 to OGND .............................-0.3V to (OV
DD
+ 0.3V)
Continuous Power Dissipation (T
A
= +70°C)
48-Pin Thin QFN (derate 26.3mW/°C above
+70°C)..............................................................................2.1W
Thermal Resistance θ
JA
.................................................+38°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
ELECTRICAL CHARACTERISTICS
(V
DD
= 3V, OV
DD
= 1.8V, internal reference (1.024V), C
L
≈ 10pF on all digital outputs, f
CLK
= 40MHz, ADC input amplitude = -0.5dBFS,
DAC output amplitude = 0dBFS, differential ADC input, differential DAC output, C
REFP
= C
REFN
= C
COM
= 0.33µF, Xcvr mode, unless
otherwise noted. Typical values are at T
A
= +25°C, unless otherwise noted.) (Note 1)
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